CY25814SXCT | Cypress Semiconductor

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CY25814SXCT
Status: 생산 중

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(pdf, 286.43 KB) RoHS PB Free

CY25814SXCT

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)32
Input Frequency Min. (MHz)4
Input Signal TypeXtal/Ref-in CMOS
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
최소 작동 온도(°C)0
최소 작동 전압(V)2.97
No. of Outputs1
No. of PLL1
Output Frequency Max. (MHz)128
Output Frequency Min. (MHz)16
Output Signal TypeCMOS
Spread SpectrumY
Tape & ReelY
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.31 $1.94 $1.73 $1.52 $1.44 $1.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

패키지 자재 고지

IPC 1752 자재 고지

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

기술 문서

제품 변경 고지(PCN) (12)

2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 25일
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2017년 10월 25일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017년 10월 16일
Shipping Label Upgrade
2017년 10월 16일
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2017년 10월 12일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 12일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2017년 10월 12일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2016년 2월 08일
Lead (Pb)- Free Marketing Part Number Definition

Product Information Notice (PIN) (2)

2017년 11월 06일
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017년 11월 06일
Changes to Cypress Address Labels

IBIS(1)

2010년 8월 12일