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512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet | Cypress Semiconductor

512 MBIT HYPERFLASH™ + 64 MBIT HYPERRAM™ 3V Multi-Chip Package (MCP) Datasheet

최신 업데이트: 
2017년 4월 28일
버전: 
*D

For systems needing both Flash and self-refresh DRAM, the HyperBus products family includes MCP devices that combine HyperFlash and HyperRAM in a single package. A HyperBus MCP reduces board space and Printed Circuit Board (PCB) signal routing congestion while also maintaining or improving signal integrity over separately packaged memory configurations.