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FM16W08: 64-Kbit (8 K × 8) Wide Voltage Bytewide F-RAM Memory | Cypress Semiconductor

FM16W08: 64-Kbit (8 K × 8) Wide Voltage Bytewide F-RAM Memory

최신 업데이트: 
2015년 9월 24일


  • 64-Kbit ferroelectric random access memory (F-RAM) logically organized as 8 K × 8
    • High-endurance 100 trillion (1014) read/writes
    • 151-year data retention (see the Data Retention and Endurance table)
    • NoDelay™ writes
    • Advanced high-reliability ferroelectric process
  • SRAM and EEPROM compatible
    • Industry-standard 8 K × 8 SRAM and EEPROM pinout
    • 70-ns access time, 130-ns cycle time
  • Superior to battery-backed SRAM modules
    • No battery concerns
    • Monolithic reliability
    • True surface mount solution, no rework steps
    • Superior for moisture, shock, and vibration
    • Resistant to negative voltage undershoots
  • 적은 전력 소비
    • Active current 12 mA (max)
    • Standby current 20 μA (typ)
  • Wide voltage operation: VDD = 2.7 V to 5.5 V
  • Industrial temperature: –40 °C to +85 °C
  • 28-pin small outline integrated circuit (SOIC) package
  • Restriction of hazardous substances (RoHS) compliant

기능 개요

The FM16W08 is a 8 K × 8 nonvolatile memory that reads and writes similar to a standard SRAM. A ferroelectric random access memory or F-RAM is nonvolatile, which means that data is retained after power is removed. It provides data retention for over 151 years while eliminating the reliability concerns, functional disadvantages, and system design complexities of battery-backed SRAM (BBSRAM). Fast write timing and high write endurance make the F-RAM superior to other types of memory.

The FM16W08 operation is similar to that of other RAM devices and therefore, it can be used as a drop-in replacement for a standard SRAM in a system. Minimum read and write cycle times are equal. The F-RAM memory is nonvolatile due to its unique ferroelectric memory process. These features make the FM16W08 ideal for nonvolatile memory applications requiring frequent or rapid writes.

The device is available in a 28-pin SOIC surface mount package. Device specifications are guaranteed over the industrial temperature range –40 °C to +85 °C.