PCN061211 | Cypress Semiconductor
PCN061211
최신 업데이트:
2018년 5월 28일
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan.
Issue Date: 2006/9/12
Effectivity Date: 2006/9/12