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PCN061211 | Cypress Semiconductor

PCN061211

최신 업데이트: 
2018년 5월 28일

Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan.

Issue Date: 2006/9/12
Effectivity Date: 2006/9/12