<44-Lead TSOP II (without down bonds), MSL3, NiPdAu, 260C Reflow, CML-R Assembly | Cypress Semiconductor

<44-Lead TSOP II (without down bonds), MSL3, NiPdAu, 260C Reflow, CML-R Assembly

최신 업데이트: 
2006년 5월 17일
버전: 
1