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Robust System Thermal Management | Cypress Semiconductor

Robust System Thermal Management

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2011년 4월 08일

Today, process technology has advanced to 32nm, resulting in an increase in the number of transistors per unit area and a reduction in package size. At the same time, system designers are trying their best to reduce the system size by increasing the component density on boards, adding as many features in the design as possible to deliver the industries’ best products in terms of space and size.