Cypress Drives Next-Generation Automotive Systems with Expanded Portfolio Including New Traveo Automotive MCU Series | Cypress Semiconductor
Cypress Drives Next-Generation Automotive Systems with Expanded Portfolio Including New Traveo Automotive MCU Series
- Broad Portfolio Allows Cypress to Serve as One-stop Supplier for Automotive Segment Solutions
- New 40nm Microcontrollers Enable High Performance and High Memory Density for Classic Instrument Clusters and Body/Gateway Applications
- Expanded Capacity for Embedded Flash Memory, eSHE and the HyperBus™ Interface Enables Firmware-Over-the-Air Upgrades for Vehicles on the Road
- New Transceiver Enables CXPI Communication Protocol in Body Control Applications for Reduced Wire Count and Improved Fuel Efficiency
SAN JOSE, Calif., 2016년 1월 12일—Cypress Semiconductor Corp. (NASDAQ: CY) today announced an expansion of its automotive portfolio that will help enable manufacturers to bring high tech automotive systems historically available only in luxury models to mainstream vehicles. Leveraging a wide range of differentiated products that includes microcontrollers (MCUs), power management ICs (PMICs), memories and touch-sensing solutions, the portfolio enables value-added systems for Cypress’s top tier automotive customers.
As a key part of the expansion, Cypress introduced the first series of its Traveo™ microcontroller (MCU) family on the 40nm process technology node, which enables higher performance and more cost-efficient implementations of instrument clusters and body electronics. The series features up to 4MB of high-density embedded flash, stepper motor control, thin-film transistor (TFT) display control, advanced sound output capabilities and support for all in-vehicle networking standards required today for instrument clusters. In addition, a new MCU in the series is optimized for high-end body and gateway systems. The 40nm technology will also provide the ability to embed more on-chip flash memory for advanced applications. The 40nm Traveo MCUs will make it easier to implement Firmware Over-The-Air (FOTA) updates, which enable consumers to get new software fixes and features and new applications for their vehicles on-the-go. More information on the Traveo MCU family is available at https://www.cypress.com/traveo.
“Cypress’s automotive portfolio is designed to help our customers bring innovative and differentiating features to their automobiles,” said Takeshi Fuse, senior vice president of the Automotive Business Unit at Cypress. “With the ramp up of our Traveo MCUs at the 40nm technology node, the family will enable a broad lineup for instrument clusters, body and electrical motor control, while opening up new functionality such as firmware over-the-air upgrades. The scalability of our Traveo platform, along with Cypress’s unique ability to serve as a one-stop resource with our automotive power management ICs and memories, will help our customers develop cost-effective systems to bring advanced functionality to mainstream vehicles. Furthermore, adopting 40nm technology for our MCUs shows our strong commitment for long-term support of automotive customers.”
Additionally, Cypress introduced a transceiver for the Clock Extension Peripheral Interface (CXPI) designed to succeed the widely-used Local Interconnect Network (LIN) automotive communication protocol. CXPI helps reduce the bill of material and lower fuel consumption by requiring fewer wires and lighter wires in a vehicle. Cypress is the only supplier to offer a CXPI transceiver and automotive MCUs, enabling a complete solution.
“The expansion of our Traveo MCU family and the addition of our CXPI transceiver demonstrates Cypress’s commitment to growing our automotive portfolio to address new applications and industry standards in order to help our top tier automotive customers meet their ever-evolving requirements,” added Fuse.
The new 40nm Traveo S6J331X/S6J332X/S6J333X/S6J334X series provides automotive manufacturers with a high-performance and cost-effective platform for classic instrument clusters. The series is based on the ARM® Cortex®-R5 processor with 240-MHz performance and supports the Controller Area Network-Flexible Data (CAN-FD) automotive communication protocol for increased data bandwidth for faster networking. The MCUs integrate up to 4MB of internal flash for application storage, enhanced secure hardware extension (eSHE) for robust security, and the industry-leading HyperBus™ interface that enables seamless connections with HyperFlash™ and HyperRAM™ memories.
Additionally, the Traveo S6J331X/S6J332X/S6J333X/S6J334X series:
- Includes a 16-bit Audio-DAC, a multi-channel mixer and I2S interfaces to output the complex, high-quality sounds required in today’s instrument clusters
- Supports Ethernet AVB for increased bandwidth in multimedia application and reduced programming time
- Combines with Cypress’s recently introduced S6BP50x series of automotive PMICs to provide a seamless solution for instrument clusters.
The new 40nm Traveo S6J335X series provides automotive manufacturers with the high performance of the other series, along with support for a maximum of eight channels for CAN-FD, enabling automotive network gateways. It includes up to 12 channels of Multi-Function Serial (MFS), up to 64 channels of 12-bit ADC inputs, and up to 64 channels of base timers, including PWMs. S6J335X supports wide ambient temperature of -40˚C to +125˚C.
The S6BT11X CXPI transceiver series works as the interface between the CXPI datalink controller and the BUS line. S6BT11X can be used to enable ECU communication with speeds going up to approximately 20kbps. The transceiver also has a sleep/wake up control function for low noise and low power dissipation, enabling reliable and energy-efficient systems.
The Traveo S6J331X/S6J332X/S6J333X/S6J334X and S6J335X series is sampling now and will be in production in the second half of 2016. It is available in 144-pin, 176-pin and 208-pin TEQFP packages.
The S6BT11X CXPI transceiver series is sampling now. It is available in an 8-pin SOP package.
Cypress Enables Leading-Edge Automotive Systems
Cypress works with the world’s top automotive companies to bring leading-edge automotive systems typical of luxury models to mainstream vehicles, including Advanced Driver Assistance Systems (ADAS), 3-D graphics displays and full-featured touchscreens. The Cypress-Spansion merger created the industry’s No. 3 provider of memories and microcontrollers (MCUs) for the automotive market with a combined portfolio that includes the Traveo™ MCU family, power-management ICs (PMICs), PSoC® programmable system-on-chip solutions, CapSense® capacitive-sensing solutions, TrueTouch® touchscreens, LED drivers, NOR flash, SRAM and F-RAM™ memories, and USB and wireless connectivity solutions. The portfolio is backed by Cypress’s commitment to zero defects, world-class service and by our adherence to the most stringent industry standards, such as the ISO/TS 16949* quality management system, the Automotive Electronics Council (AEC) guidelines for ICs and the Production Part Approval Process (PPAP). Learn more at https://www.cypress.com/automotive.
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Cypress (NASDAQ: CY) delivers high-performance, high-quality solutions at the heart of today’s most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes NOR flash memories, F-RAM™ and SRAM, Traveo microcontrollers, the industry’s only PSoC® programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense® capacitive touch-sensing controllers, and Wireless BLE Bluetooth® Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, best-in-class support and exceptional system value. To learn more, go to https://www.cypress.com.
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Cypress, the Cypress logo, PSoC and CapSense are registered trademarks and Traveo, HyperBus, HyperFlash, HyperRAM and F-RAM are trademarks of Cypress Semiconductor Corp. All other trademarks are property of their owners.