BCM20713A1KUFBXG | Cypress Semiconductor

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BCM20713A1KUFBXG
Status: NRND: 영업팀에 문의

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(pdf, 560.24 KB) RoHS PB Free

BCM20713A1KUFBXG

Automotive GradeAutomotive Grade 3
인증 자동차N
Bluetooth Power ClassClass 1, Class 2, Class 3
Bluetooth SpecificationBluetooth 4.0
CPU CoreARM7TDMI-S
Co-existence InterfaceLegacy SECI
Device TypeSilicon
FM Transceiver (TX/RX)N
InterfacesUART,I2C,SPI, I2S/PCM
MIMO/SISO해당 없음
최대 작동 주파수(MHz)48
최대 작동 온도(°C)85
최대 작동 전압(V)3.60
최소 작동 온도(°C)-30
최소 작동 전압(V)1.40
GPIO 개수8
Partner ModulesN
Product FamilyBCM20713
RAM (KB)112 KB
Silicon FeaturesIntegrated Regulator, HCI-over-UART/SPI
Tape & ReelN
Wi-Fi Band해당 없음
Wi-Fi PHY Data Rate (Mbps)해당 없음
Wireless TechnologyBluetooth (BR + EDR)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
영업팀에 문의
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
50
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
3430
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Sn/Ag/Cu

기술 문서

애플리케이션 설명 (7)

제품 변경 고지(PCN) (2)

2017년 10월 11일
Transition from Broadcom Marketing Part Numbers to Cypress Marketing Part Numbers
2017년 10월 11일
Qualification of STATS ChipPAC Jiangyin (JSCC) as an Additional Assembly Site for Select BGA Products

Product Information Notice (PIN) (4)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Wireless Products Failure Analysis Policy Change
2020년 3월 25일
Acquisition of Broadcom's Internet of Things Business