BCM88335L2CUBGT | Cypress Semiconductor
BCM88335L2CUBGT
| Automotive Grade | Automotive Grade 3 |
| 인증 자동차 | N |
| Bluetooth Power Class | Class 1, Class 2 |
| Bluetooth Specification | Bluetooth 4.1 |
| Co-existence Interface | Integrated Wi-Fi and Bluetooth Coexistence, GCI SECI for external radios |
| Device Type | Silicon |
| Driver Support | Linux |
| FM Transceiver (TX/RX) | N |
| Interfaces | SDIO 3.0/2.0, gSPI for Wi-Fi and I2C/PCM audio, HCI-over UART for Bluetooth |
| MIMO/SISO | 1x1 SISO |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 4.80 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 3.00 |
| Module Features | 해당 없음 |
| GPIO 개수 | 9 |
| Partner Modules | N |
| Product Family | BCM88335 |
| Security and Encryption | WPA/WPA2. WAPI STA Network Security, AES encryption/decryption with TKIP and IEEE 802.1x support, Cisco Extension Support, WPS |
| Silicon Features | Integrated PA, PMU with Buck-Mode Switching Regulator, Shared Bluetooth and Wi-Fi Antenna Support |
| Tape & Reel | Y |
| Wi-Fi Band | Dual Band (2.4/5Ghz) |
| Wi-Fi PHY Data Rate (Mbps) | upto 433Mbps |
| Wireless Technology | Wi-Fi, Bluetooth (BR + EDR + BLE) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| 영업팀에 문의 | |||||
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Sn/Ag/Cu;Sn/Ag
Marking
기술 문서
애플리케이션 설명 (7)
2020년 6월 02일
제품 변경 고지(PCN) (2)
2020년 4월 14일
Qualification of PTI-SG as an Additional Bumping, Wafer Sort, Backend and Finish Site for Select WLCSP Products
2017년 10월 11일
Removal of Broadcom Logo and Transition to Cypress Part Number for Automotive IoT Products
Advanced Product Change Notice (APCN) (7)
Product Information Notice (PIN) (4)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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