CY14B104NA-ZS25XE | Cypress Semiconductor

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CY14B104NA-ZS25XE
Status: 생산 중

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(pdf, 601.6 KB) RoHS PB Free

CY14B104NA-ZS25XE

인증 자동차Y
밀도(Kb)4096
주파수(MHz)해당 없음
인터페이스Parallel
최대 작동 온도(°C)125
Max. Operating VCCQ (V)3.60
최대 작동 전압(V)3.60
최소 작동 온도(°C)-40
최소 작동 전압(V)2.70
구성(X x Y)256Kb x 16
Part Family병렬 nvSRAM
속도(ns)25
Tape & ReelN
온도 분류Automotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$53.62 $47.57 $44.69 $41.80 $39.50 $36.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au/Ag;Pure Sn

기술 문서

애플리케이션 설명 (10)

제품 변경 고지(PCN) (2)

2020년 4월 14일
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
2020년 4월 14일
Qualification of Cypress’s Fab 25 as an Additional Wafer Fab Site and Cypress’s Test 25 as an Additional Wafer Sort Site for the 4Mb Automotive nvSRAM Product Family

Advanced Product Change Notice (APCN) (4)

2020년 7월 21일
Q32020 Automotive Horizon Report Update
2020년 4월 22일
Q220 Automotive Horizon Report Update
2020년 4월 14일
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
2020년 4월 14일
2020 Annual Automotive Horizon Update

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization