CY14B104NA-ZS25XE | Cypress Semiconductor
CY14B104NA-ZS25XE
| 인증 자동차 | Y |
| 밀도(Kb) | 4096 |
| 주파수(MHz) | 해당 없음 |
| 인터페이스 | Parallel |
| 최대 작동 온도(°C) | 125 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.70 |
| 구성(X x Y) | 256Kb x 16 |
| Part Family | 병렬 nvSRAM |
| 속도(ns) | 25 |
| Tape & Reel | N |
| 온도 분류 | Automotive(E) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $53.62 | $47.57 | $44.69 | $41.80 | $39.50 | $36.90 |
Packaging/Ordering
패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Ni/Pd/Au/Ag;Pure Sn
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (10)
2018년 2월 18일
제품 변경 고지(PCN) (2)
2020년 4월 14일
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
2020년 4월 14일
Qualification of Cypress’s Fab 25 as an Additional Wafer Fab Site and Cypress’s Test 25 as an Additional Wafer Sort Site for the 4Mb Automotive nvSRAM Product Family
Advanced Product Change Notice (APCN) (4)
2020년 4월 14일
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Product Information Notice (PIN) (2)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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