CY14B108L-ZS45XIT | Cypress Semiconductor
CY14B108L-ZS45XIT
| 인증 자동차 | N |
| 밀도(Kb) | 8192 |
| 주파수(MHz) | 해당 없음 |
| 인터페이스 | Parallel |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.70 |
| 구성(X x Y) | 1Mb x 8 |
| Part Family | 병렬 nvSRAM |
| 속도(ns) | 45 |
| Tape & Reel | Y |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $67.78 | $60.13 | $56.48 | $52.84 | $49.92 | $46.64 |
Packaging/Ordering
패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
Y
무연
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (10)
2018년 2월 18일
제품 변경 고지(PCN) (11)
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020년 5월 6일
Qualification of Die Attach Material and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSET
2020년 5월 6일
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2020년 4월 14일
Addendum to PCN192401 - Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
2020년 4월 14일
Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (8)
2020년 4월 14일
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (7)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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