CY14B108N-ZSP25XIT | Cypress Semiconductor
CY14B108N-ZSP25XIT
| 인증 자동차 | N |
| 밀도(Kb) | 8192 |
| 주파수(MHz) | 해당 없음 |
| 인터페이스 | Parallel |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.70 |
| 구성(X x Y) | 512Kb x 16 |
| Part Family | 병렬 nvSRAM |
| 속도(ns) | 25 |
| Tape & Reel | Y |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $62.55 | $55.49 | $52.13 | $48.76 | $46.07 | $43.05 |
Packaging/Ordering
패키지
No. of Pins
54
Package Dimensions
878 L x 1.2 H x 400 W (Mils)
Package Weight
580.02 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn
Marking
기술 문서
애플리케이션 설명 (10)
2018년 2월 18일
제품 변경 고지(PCN) (6)
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
2020년 4월 14일
Qualification of Hwa Shu Shipping Tray for 54-Lead TSOP II Product Shipments at ASE Taiwan
Product Information Notice (PIN) (7)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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