CY14B256LA-SZ25XI | Cypress Semiconductor
CY14B256LA-SZ25XI
| 인증 자동차 | N |
| 밀도(Kb) | 256 |
| 주파수(MHz) | 해당 없음 |
| 인터페이스 | Parallel |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.70 |
| 구성(X x Y) | 32Kb x 8 |
| Part Family | 병렬 nvSRAM |
| 속도(ns) | 25 |
| Tape & Reel | N |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $21.19 | $18.79 | $17.65 | $16.52 | $15.60 | $14.58 |
Packaging/Ordering
패키지
No. of Pins
32
Package Dimensions
816 L x 95 H x 300 W (Mils)
Package Weight
855.99 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
330
Minimum Order Quantity (MOQ)
44
Order Increment
44
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (10)
2018년 2월 18일
제품 변경 고지(PCN) (5)
2020년 4월 14일
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for 3V/5V 1Mb Parallel nvSRAM Products
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 11일
Transfer of Assembly Site from Amkor Philippines to UTL Thailand for 32-Lead SOIC Product
Product Information Notice (PIN) (5)
2020년 5월 7일
Qualification of UTL as an additional finish site for 14-lead DFN and 32-lead SOIC packages
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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