CY22150KFZXI | Cypress Semiconductor

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CY22150KFZXI
Status: 사용 안 함

CY22150KFZXI

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)1
Input Signal TypeXtal/Ref-in CMOS
최대 작동 온도(°C)85
최대 작동 전압(V)3.45
최소 작동 온도(°C)-40
최소 작동 전압(V)3.13
No. of Outputs6
No. of PLL1
Output Frequency Max. (MHz)166.6
Output Frequency Min. (MHz)0.08
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelN
온도 분류산업

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.16 $3.50 $3.12 $2.74 $2.59 $2.42
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
192
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
28
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

패키지 자재 고지

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

기술 문서

개발 키트/보드 (1)

소프트웨어와 드라이버 (1)

2011년 2월 11일

제품 변경 고지(PCN) (8)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (2)

2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2017년 11월 10일
July 2014 Product Obsolescence Notification

IBIS(1)

2010년 1월 08일