CY22394FXC | Cypress Semiconductor
CY22394FXC
인증 자동차 | N |
Core Voltage (V) | 3.3 |
I/O Voltage (V) | 3.3 |
Input Frequency Max. (MHz) | 166 |
Input Frequency Min. (MHz) | 1 |
Input Signal Type | Xtal/Ref-in CMOS |
최대 작동 온도(°C) | 70 |
최대 작동 전압(V) | 3.45 |
최소 작동 온도(°C) | 0 |
최소 작동 전압(V) | 3.13 |
No. of Outputs | 5 |
No. of PLL | 3 |
Output Frequency Max. (MHz) | 400 |
Output Frequency Min. (MHz) | 0 |
Output Signal Type | CMOS/LVPECL |
Spread Spectrum | N |
Tape & Reel | N |
온도 분류 | 상용 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$10.25 | $8.62 | $7.69 | $6.76 | $6.38 | $5.96 |
Packaging/Ordering
패키지
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
패키지 자재 고지
Last Update: 2016년 11월 21일
IPC 1752 자재 고지
Last Update: 2020년 2월 05일
Last Update: 2020년 2월 05일
기술 문서
제품 변경 고지(PCN) (16)
2021년 1월 11일
Qualification of Greatek Electronics Inc. as an Alternate Assembly Site for Select 16-Lead TSSOP Package
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 29일
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the CY2238x/ CY2239x, 3-PLL Clock Synthesizers
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 27일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (4)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation