CY2305SXC-1 | Cypress Semiconductor

You are here

CY2305SXC-1
Status: 생산 중

데이터시트

(pdf, 655.33 KB) RoHS PB Free

CY2305SXC-1

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
최소 작동 온도(°C)0
최소 작동 전압(V)3.00
No. of Outputs5
No. of PLL1
Output Frequency Max. (MHz)133
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread SpectrumN
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.04 $2.55 $2.28 $2.00 $1.89 $1.77
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

패키지
SOP
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2910
Minimum Order Quantity (MOQ)
970
Order Increment
970
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

기술 문서

제품 변경 고지(PCN) (19)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 29일
Clarification on Product Change Notice 084713 issued on September 23,2008
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 28일
Datasheet changes to the method of specification of IDDS and Duty Cycle in the Cypress Zero Delay Buffer (ZDB) products, CY2304, CY2305, CY2309 and CY2308
2018년 5월 28일
Lead (Pb)- Free Marketing Part Number Definition
2018년 5월 28일
Qualification of TSMC as an alternate wafer fabrication site for the Zero Delay Buffer General Purpose Clocks Family
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018년 5월 27일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017년 10월 13일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8, 14 and 16 lead 150 mils SOIC Pb-free packages assembled at Orient Semiconductor Electronics, Tai

Advanced Product Change Notice (APCN) (3)

2020년 8월 23일
Q32020 Horizon Report Update
2020년 4월 22일
Q220 Standard Horizon Report Update
2018년 5월 27일
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor

Product Information Notice (PIN) (3)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
Changes to Cypress Address Labels

IBIS(1)

2010년 6월 10일