CY24242OXC | Cypress Semiconductor

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Status: 사용 안 함


인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)14.31818
Input Frequency Min. (MHz)14.31818
Input Signal TypeXtal/Ref-in CMOS
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
최소 작동 온도(°C)0
최소 작동 전압(V)3.00
No. of Outputs10
No. of PLL2
Output Frequency Max. (MHz)133.3
Output Frequency Min. (MHz)14.31818
Output Signal TypeCMOS
Spread SpectrumY
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.08 $2.59 $2.31 $2.03 $1.92 $1.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

기술 문서

제품 변경 고지(PCN) (12)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 28일
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
2018년 5월 28일
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
2018년 5월 27일
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (1)

2017년 11월 06일
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2017년 11월 10일
July 2014 Product Obsolescence Notification


2012년 4월 03일