CY2510ZXC-1 | Cypress Semiconductor

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CY2510ZXC-1
Status: 사용 안 함

CY2510ZXC-1

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)40
Input Signal TypeLVCMOS/LVTTL
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
최소 작동 온도(°C)0
최소 작동 전압(V)3.00
No. of Outputs11
No. of PLL1
Output Frequency Max. (MHz)140
Output Frequency Min. (MHz)40
Output Signal TypeLVCMOS/LVTTL
Spread SpectrumY
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.09 $1.76 $1.57 $1.38 $1.30 $1.22
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
24
Package Dimensions
312 L x 1 H x 173 W (Mils)
Package Weight
92.26 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
620
Minimum Order Quantity (MOQ)
620
Order Increment
620
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016년 9월 15일

기술 문서

제품 변경 고지(PCN) (12)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (1)

2017년 11월 06일
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2017년 11월 10일
July 2014 Product Obsolescence Notification

IBIS(1)

2010년 3월 02일