CY25811SXC | Cypress Semiconductor

You are here

CY25811SXC
Status: 사용 안 함

데이터시트

(pdf, 286.43 KB) RoHS PB Free

CY25811SXC

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)32
Input Frequency Min. (MHz)4
Input Signal TypeXtal/Ref-in CMOS
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
최소 작동 온도(°C)0
최소 작동 전압(V)2.97
No. of Outputs1
No. of PLL1
Output Frequency Max. (MHz)32
Output Frequency Min. (MHz)4
Output Signal TypeCMOS
Spread SpectrumY
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.95 $5.85 $5.21 $4.58 $4.33 $4.04
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
SOP
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2910
Minimum Order Quantity (MOQ)
485
Order Increment
485
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

기술 문서

제품 변경 고지(PCN) (15)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 28일
Lead (Pb)- Free Marketing Part Number Definition
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018년 5월 27일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (1)

2017년 11월 06일
Changes to Cypress Address Labels

IBIS(1)

2010년 8월 12일