CY25811SXC | Cypress Semiconductor
CY25811SXC
| 인증 자동차 | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 32 |
| Input Frequency Min. (MHz) | 4 |
| Input Signal Type | Xtal/Ref-in CMOS |
| 최대 작동 온도(°C) | 70 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | 0 |
| 최소 작동 전압(V) | 2.97 |
| No. of Outputs | 1 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 32 |
| Output Frequency Min. (MHz) | 4 |
| Output Signal Type | CMOS |
| Spread Spectrum | Y |
| Tape & Reel | N |
| 온도 분류 | 상용 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $6.95 | $5.85 | $5.21 | $4.58 | $4.33 | $4.04 |
Packaging/Ordering
패키지
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2910
Minimum Order Quantity (MOQ)
485
Order Increment
485
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
Last Update: 2020년 9월 21일
Last Update: 2020년 4월 15일
Last Update: 2019년 11월 04일
기술 문서
제품 변경 고지(PCN) (15)
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 27일
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018년 5월 27일
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
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