CY2DP814ZXC | Cypress Semiconductor

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CY2DP814ZXC
Status: 사용 안 함

CY2DP814ZXC

인증 자동차N
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)450
Input Frequency Min. (MHz)0
Input Signal TypeLVDS/LVPECL/LVTTL
최대 작동 온도(°C)70
최대 작동 전압(V)3.45
최소 작동 온도(°C)0
최소 작동 전압(V)3.13
No. of Outputs4
No. of PLL0
Output Frequency Max. (MHz)450
Output Frequency Min. (MHz)0
Output Signal TypeLVPECL
Spread SpectrumN
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.71 $5.64 $5.03 $4.42 $4.18 $3.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
192
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
91
HTS Code
8542.39.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

패키지 자재 고지

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2016년 9월 15일

기술 문서

제품 변경 고지(PCN) (13)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
2017년 10월 20일
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs

Product Information Notice (PIN) (1)

2017년 11월 06일
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

2017년 11월 10일
July 2014 Product Obsolescence Notification

IBIS (2)

2011년 2월 11일
2011년 2월 11일