CY62128ELL-45SXI | Cypress Semiconductor
CY62128ELL-45SXI
| 인증 자동차 | N |
| 밀도(Kb) | 1024 |
| 주파수(MHz) | 해당 없음 |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 5.50 |
| 최대 작동 전압(V) | 5.50 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 4.50 |
| 구성(X x Y) | 128K x 8 |
| Part Family | Async Micropower (MoBL) SRAMs |
| 속도(ns) | 45 |
| Tape & Reel | N |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.19 | $2.68 | $2.39 | $2.10 | $1.99 | $1.86 |
Packaging/Ordering
패키지
No. of Pins
32
Package Dimensions
810 L x 0 H x 450 W (Mils)
Package Weight
1 340.00 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
375
Minimum Order Quantity (MOQ)
375
Order Increment
375
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (2)
제품 변경 고지(PCN) (13)
2020년 9월 20일
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 7월 29일
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Qualification of KEG6000DA and KEG3000DA Green Mold Compound for 32 leads, Lead-free and standard, 450 mil body size, SOIC Packages Assembled at Cypress
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (4)
2020년 4월 14일
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (4)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
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