CY62146EV30LL-45BVXI | Cypress Semiconductor
CY62146EV30LL-45BVXI
| Development Kit | 해당 없음 |
| 인증 자동차 | N |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.20 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.68 | $6.46 | $5.76 | $5.06 | $4.78 | $4.47 |
Packaging/Ordering
패키지
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 자재 고지
Last Update: 2020년 6월 03일
Last Update: 2018년 6월 26일
Package Qualification Report
Last Update: 2015년 8월 07일
기술 문서
애플리케이션 설명 (2)
제품 변경 고지(PCN) (10)
2020년 9월 16일
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial Grade 4Mb MoBL® SRAM Products
2020년 4월 14일
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018년 5월 28일
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
2018년 5월 28일
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
2017년 10월 31일
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (4)
2020년 7월 06일
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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