CY62157ELL-45ZSXIT | Cypress Semiconductor

CY62157ELL-45ZSXIT
Status: 생산 중

데이터시트

(pdf, 531.08 KB) RoHS PB Free

CY62157ELL-45ZSXIT

인증 자동차N
밀도(Kb)8192
주파수(MHz)해당 없음
최대 작동 온도(°C)85
Max. Operating VCCQ (V)5.50
최대 작동 전압(V)5.50
최소 작동 온도(°C)-40
Min. Operating VCCQ (V)4.50
최소 작동 전압(V)4.50
구성(X x Y)512K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
속도(ns)45
Tape & ReelY
온도 분류산업

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.43 $15.50 $13.82 $12.15 $11.62 $10.99
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

기술 문서

애플리케이션 설명 (2)

제품 변경 고지(PCN) (14)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020년 4월 14일
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018년 5월 28일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 27일
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

2020년 8월 23일
Q32020 Horizon Report Update

Product Information Notice (PIN) (8)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017년 11월 06일
Changes to Cypress Address Labels
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017년 10월 25일
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

백서 (1)

2016년 4월 12일

VHDL (1)

2009년 9월 02일