CY62157ESL-45ZSXIT | Cypress Semiconductor
CY62157ESL-45ZSXIT
인증 자동차 | N |
밀도(Kb) | 8192 |
주파수(MHz) | 해당 없음 |
최대 작동 온도(°C) | 85 |
Max. Operating VCCQ (V) | 5.50 |
최대 작동 전압(V) | 5.50 |
최소 작동 온도(°C) | -40 |
최소 작동 전압(V) | 2.20 |
구성(X x Y) | 512K x 16 |
Part Family | Async Micropower (MoBL) SRAMs |
속도(ns) | 45 |
Tape & Reel | Y |
온도 분류 | 산업 |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$14.41 | $12.12 | $10.81 | $9.50 | $8.97 | $8.38 |
Packaging/Ordering
패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (2)
제품 변경 고지(PCN) (10)
2020년 12월 20일
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2020년 4월 14일
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (7)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products