CY62167EV30LL-45ZXA | Cypress Semiconductor
CY62167EV30LL-45ZXA
| Development Kit | 해당 없음 |
| 인증 자동차 | Y |
| 밀도(Kb) | 16384 |
| 주파수(MHz) | 해당 없음 |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.20 |
| 구성(X x Y) | 1M x 16 |
| 속도(ns) | 45 |
| Tape & Reel | N |
| 온도 분류 | Automotive(A) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $18.02 | $15.15 | $13.51 | $11.88 | $11.22 | $10.48 |
Packaging/Ordering
패키지
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Matte Tin Plating
Marking
기술 문서
애플리케이션 설명 (2)
제품 변경 고지(PCN) (3)
2020년 4월 14일
Qualification of Cypress Bangkok as an Additional Assembly Site for Select 48-Lead TSOP I, 18.4x12x1.2mm, Pb-Free Products
Advanced Product Change Notice (APCN) (6)
2020년 4월 14일
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Product Information Notice (PIN) (4)
2020년 5월 6일
90nm 16-Mbit (1M x 16/2M x 8) MoBL Automotive-Grade SRAM Product Family Datasheet Update
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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