CY7C1010DV33-10ZSXI | Cypress Semiconductor
CY7C1010DV33-10ZSXI
| 인증 자동차 | N |
| 밀도(Kb) | 2048 |
| 주파수(MHz) | 해당 없음 |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| 최소 작동 전압(V) | 3.00 |
| 구성(X x Y) | 256K x 8 |
| Part Family | 비동기식 고속 SRAM |
| 속도(ns) | 10 |
| Tape & Reel | N |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.73 | $3.98 | $3.55 | $3.12 | $2.95 | $2.75 |
Packaging/Ordering
패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
Y
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (1)
제품 변경 고지(PCN) (13)
2021년 3월 29일
Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products
2020년 12월 20일
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 5월 8일
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
2018년 5월 28일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 27일
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (5)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
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