CY7C1021CV26-15ZSXE | Cypress Semiconductor
CY7C1021CV26-15ZSXE
| Development Kit | 해당 없음 |
| 인증 자동차 | Y |
| 밀도(Kb) | 1024 |
| 주파수(MHz) | 해당 없음 |
| 최대 작동 온도(°C) | 125 |
| Max. Operating VCCQ (V) | 2.70 |
| 최대 작동 전압(V) | 2.70 |
| 최소 작동 온도(°C) | -40 |
| Min. Operating VCCQ (V) | 2.50 |
| 최소 작동 전압(V) | 2.50 |
| 구성(X x Y) | 64K x 16 |
| 속도(ns) | 15 |
| Tape & Reel | N |
| 온도 분류 | Automotive(E) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $5.94 | $5.00 | $4.46 | $3.92 | $3.70 | $3.46 |
Packaging/Ordering
패키지
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (1)
제품 변경 고지(PCN) (9)
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 5월 8일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
2020년 4월 14일
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
2018년 5월 29일
Qualification of Chipmos,Taiwan as an additional Burn In site for 44 pin TSOP II Package for selected automotive grade SRAMs
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 20일
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs
Advanced Product Change Notice (APCN) (5)
2020년 4월 14일
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Product Information Notice (PIN) (4)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2018년 5월 27일
Qualification of ChipMOS Taiwan as an additional Burn-In, Test and Finish site for select automotive grade products in 44-pin TSOP II and 100-pin TQFP packages
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