CY7C1041G18-15VXI | Cypress Semiconductor

You are here

CY7C1041G18-15VXI
Status: 생산 중

데이터시트

(pdf, 658.1 KB) RoHS PB Free
(pdf, 542.49 KB) RoHS PB Free
(pdf, 642.01 KB) RoHS PB Free

CY7C1041G18-15VXI

인증 자동차N
밀도(Kb)4096
주파수(MHz)해당 없음
최대 작동 온도(°C)85
Max. Operating VCCQ (V)2.20
최대 작동 전압(V)2.20
최소 작동 온도(°C)-40
Min. Operating VCCQ (V)1.65
최소 작동 전압(V)1.65
구성(X x Y)256K x 16
Part FamilyAsync SRAM with ECC
속도(ns)15
Tape & ReelN
온도 분류산업

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.37 $6.20 $5.53 $4.86 $4.59 $4.29
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
SOP
No. of Pins
44
Package Dimensions
1 125 L x 0 H x 400 W (Mils)
Package Weight
1 785.53 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
170
Minimum Order Quantity (MOQ)
170
Order Increment
170
Estimated Lead Time (days)
364
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn

기술 문서

애플리케이션 설명 (2)

제품 변경 고지(PCN) (5)

2020년 9월 20일
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 7월 29일
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 4월 14일
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
2020년 4월 14일
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2017년 10월 31일
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.

Advanced Product Change Notice (APCN) (4)

2020년 8월 23일
Q32020 Horizon Report Update
2020년 4월 22일
Q220 Standard Horizon Report Update
2020년 4월 14일
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
2020년 4월 14일
2020 Annual Horizon Report Update

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization

IBIS(1)

2016년 7월 05일