CY7C1263XV18-600BZXC | Cypress Semiconductor
CY7C1263XV18-600BZXC
| 아키텍처 | QDR-II+ Xtreme |
| 인증 자동차 | N |
| 버스트 길이(단어 수) | 4 |
| 밀도(Kb) | 36864 |
| Density (Mb) | 36 |
| 주파수(MHz) | 600 |
| 최대 작동 온도(°C) | 70 |
| Max. Operating VCCQ (V) | 1.90 |
| 최대 작동 전압(V) | 1.90 |
| 최소 작동 온도(°C) | 0 |
| Min. Operating VCCQ (V) | 1.40 |
| 최소 작동 전압(V) | 1.70 |
| 구성(X x Y) | 2Mb x 18 |
| Tape & Reel | N |
| 온도 분류 | 상용 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $111.07 | $93.94 | $90.76 | $86.95 | $84.42 | $81.88 |
Packaging/Ordering
패키지
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
35
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
패키지 자재 고지
Last Update: 2016년 11월 09일
Package Qualification Report
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
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