CY7C1357C-100BZC | Cypress Semiconductor
CY7C1357C-100BZC
Status: 생산 중
데이터시트
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CY7C1357C-100BZC
| 아키텍처 | NoBL, Flow-through |
| 인증 자동차 | N |
| 밀도(Kb) | 9216 |
| Density (Mb) | 9 |
| 주파수(MHz) | 100 |
| 최대 작동 온도(°C) | 70 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.63 |
| 최소 작동 온도(°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| 최소 작동 전압(V) | 3.14 |
| 구성(X x Y) | 512Kb x 18 |
| Part Family | NoBL |
| Part Family | NoBL |
| Tape & Reel | N |
| 온도 분류 | 상용 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $13.93 | $12.42 | $11.52 | $10.62 | $10.24 | $9.79 |
Packaging/Ordering
패키지
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1360
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS 준수
무연
N
Lead/Ball Finish
Sn/Pb
Marking
패키지 자재 고지
Last Update: 2017년 9월 04일
기술 문서
애플리케이션 설명 (3)
제품 변경 고지(PCN) (11)
2018년 5월 28일
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
2018년 5월 28일
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
2018년 5월 28일
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
2018년 5월 27일
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Product Information Notice (PIN) (3)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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