CY7C1372DV25-167AXCT | Cypress Semiconductor
CY7C1372DV25-167AXCT
| 아키텍처 | NoBL, Pipeline |
| 인증 자동차 | N |
| 밀도(Kb) | 18432 |
| Density (Mb) | 18 |
| 주파수(MHz) | 167 |
| 최대 작동 온도(°C) | 70 |
| Max. Operating VCCQ (V) | 2.60 |
| 최대 작동 전압(V) | 2.63 |
| 최소 작동 온도(°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| 최소 작동 전압(V) | 2.38 |
| 구성(X x Y) | 1Mb x 18 |
| Tape & Reel | Y |
| 온도 분류 | 상용 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $29.77 | $26.55 | $24.62 | $22.69 | $21.88 | $20.92 |
Packaging/Ordering
패키지
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
750
Minimum Order Quantity (MOQ)
750
Order Increment
750
Estimated Lead Time (days)
364
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
Last Update: 2020년 5월 11일
Last Update: 2019년 10월 30일
기술 문서
애플리케이션 설명 (3)
제품 변경 고지(PCN) (12)
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 4월 14일
Addendum to PCN161201:18Mb Technology Transition from 90nm to 65nm (18Mb Sync and NoBL Products)
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (4)
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
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