CY7C1470BV25-200BZXI | Cypress Semiconductor
CY7C1470BV25-200BZXI
| 아키텍처 | NoBL, Pipeline |
| 인증 자동차 | N |
| 밀도(Kb) | 73728 |
| Density (Mb) | 72 |
| 주파수(MHz) | 200 |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 2.60 |
| 최대 작동 전압(V) | 2.63 |
| 최소 작동 온도(°C) | -40 |
| Min. Operating VCCQ (V) | 2.40 |
| 최소 작동 전압(V) | 2.38 |
| 구성(X x Y) | 2Mb x 36 |
| Part Family | NoBL |
| Part Family | NoBL |
| Tape & Reel | N |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $173.60 | $146.82 | $141.86 | $135.90 | $131.94 | $127.97 |
Packaging/Ordering
패키지
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
645.61 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1050
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
147
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
기술 문서
애플리케이션 설명 (3)
제품 변경 고지(PCN) (4)
2018년 5월 28일
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
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