CY7C1474V25-200BGC | Cypress Semiconductor
CY7C1474V25-200BGC
Status: 생산 중
데이터시트
(pdf, 767.28 KB)
CY7C1474V25-200BGC
| 아키텍처 | NoBL, Pipeline |
| 인증 자동차 | N |
| 밀도(Kb) | 73728 |
| Density (Mb) | 72 |
| 주파수(MHz) | 200 |
| 최대 작동 온도(°C) | 70 |
| Max. Operating VCCQ (V) | 2.60 |
| 최대 작동 전압(V) | 2.63 |
| 최소 작동 온도(°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| 최소 작동 전압(V) | 2.38 |
| 구성(X x Y) | 1Mb x 72 |
| Part Family | NoBL |
| Part Family | NoBL |
| Tape & Reel | N |
| 온도 분류 | 상용 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $168.00 | $142.08 | $137.28 | $131.52 | $127.68 | $123.84 |
Packaging/Ordering
패키지
No. of Pins
209
Package Dimensions
551 L x 1.8 H x 866 W (Mils)
Package Weight
1 160.20 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
840
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
147
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS 준수
무연
N
Lead/Ball Finish
Sn/Pb
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016년 7월 28일
기술 문서
애플리케이션 설명 (3)
제품 변경 고지(PCN) (6)
2018년 5월 27일
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
2018년 5월 27일
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
2018년 5월 27일
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
Product Information Notice (PIN) (3)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Powered By OneLink