CY7C199D-10VXIT | Cypress Semiconductor
CY7C199D-10VXIT
| 인증 자동차 | N |
| 밀도(Kb) | 256 |
| 주파수(MHz) | 해당 없음 |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 5.50 |
| 최대 작동 전압(V) | 5.50 |
| 최소 작동 온도(°C) | -40 |
| Min. Operating VCCQ (V) | 4.50 |
| 최소 작동 전압(V) | 4.50 |
| 구성(X x Y) | 32K x 8 |
| Part Family | 비동기식 고속 SRAM |
| 속도(ns) | 10 |
| Tape & Reel | Y |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.20 | $1.85 | $1.65 | $1.45 | $1.39 | $1.31 |
Packaging/Ordering
패키지
No. of Pins
28
Package Dimensions
705 L x 1 H x 300 W (Mils)
Package Weight
868.67 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (1)
제품 변경 고지(PCN) (10)
2020년 9월 20일
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 7월 29일
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 5월 8일
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
2020년 4월 14일
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Advanced Product Change Notice (APCN) (4)
2020년 4월 14일
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (4)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
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