CY7C25422KV18-333BZXC | Cypress Semiconductor

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CY7C25422KV18-333BZXC
Status: 생산 중

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CY7C25422KV18-333BZXC

아키텍처QDR-II+, ODT
인증 자동차N
버스트 길이(단어 수)2
밀도(Kb)73728
Density (Mb)72
주파수(MHz)333
최대 작동 온도(°C)85
Max. Operating VCCQ (V)1.90
최대 작동 전압(V)1.90
최소 작동 온도(°C)-40
Min. Operating VCCQ (V)1.40
최소 작동 전압(V)1.70
구성(X x Y)4Mb x 18
Part FamilyQDR-II+, ODT
Part FamilyQDR-II+, ODT
Tape & ReelN
온도 분류상용

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$285.34 $249.68 $244.33 $238.98 $233.63 $228.28
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
BGA
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1360
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Sn/Ag/Cu

패키지 자재 고지

기술 문서

애플리케이션 설명 (7)

제품 변경 고지(PCN) (4)

2020년 4월 14일
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
2020년 4월 14일
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2017년 11월 09일
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017년 10월 10일
PCN154102 - Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization