CY7C53120E4-40AXI | Cypress Semiconductor

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CY7C53120E4-40AXI
Status: 생산 중

데이터시트

(pdf, 539.48 KB) RoHS PB Free

CY7C53120E4-40AXI

인증 자동차N
플래시(KB)4
Max. Input Clock (MHz)40
최대 작동 온도(°C)85
최대 작동 전압(V)5.00
최소 작동 온도(°C)-40
최소 작동 전압(V)5.00
ROM (KB)12
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
영업팀에 문의
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

패키지
QFP
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1600
Minimum Order Quantity (MOQ)
160
Order Increment
160
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn

기술 문서

애플리케이션 설명 (1)

제품 변경 고지(PCN) (15)

2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2020년 4월 14일
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
2018년 5월 28일
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Qualification of Cypress Minnesota as Alternate Wafer Fabrication Facility for Neuron® Chip Network Processor Products
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 11월 09일
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (2)

2018년 5월 27일
Advance Notification - Planned Changes to MoBL-USB TX3LP18
2018년 5월 27일
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Cypress Manufacturing Minnesota

Product Information Notice (PIN) (7)

2020년 7월 28일
USB Products Failure Analysis Policy Change
2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 07일
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017년 11월 06일
Changes to Cypress Address Labels
2017년 11월 06일
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
2017년 10월 25일
Qualification of Kyocera Green Mold Compound: Information-Only Announcement