CY7C60413-16LKXCT | Cypress Semiconductor

CY7C60413-16LKXCT
Status: 사용 안 함

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(pdf, 798.22 KB) RoHS PB Free

CY7C60413-16LKXCT

Development KitCY3660
애플리케이션Wireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
인증 자동차N
CPU CoreM8C
Code Memory Architecture플래시
Code Memory Size (KB)8
I/O 옵션GPIO, I2C, SPI, ADC
최대 작동 온도(°C)70
최대 작동 전압(V)3.60
Max. Speed (MHz)24
최소 작동 온도(°C)0
최소 작동 전압(V)1.71
I/O 수13
RAM Size (Bytes)1024
소프트웨어 도구Y
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.28 $1.97 $1.86 $1.55 $1.51 $1.40
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
QFN
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

기술 문서

애플리케이션 설명 (6)

제품 변경 고지(PCN) (5)

2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 24일
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
2017년 10월 24일
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
2017년 10월 23일
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (5)

2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Qualification of New Carrier Tape Supplier at Cypress Philippines
2017년 11월 06일
Changes to Cypress Address Labels
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Termination Notice (PTN) (3)

2020년 4월 14일
Addendum to PTN173701A - October 2017 Product Obsolescence Notification
2020년 4월 14일
Addendum to PTN173701 - October 2017 Product Obsolescence Notification
2020년 4월 14일
October 2017 Product Obsolescence Notification