CY7C63823-QXC | Cypress Semiconductor

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CY7C63823-QXC
Status: 사용 안 함

데이터시트

(pdf, 860.67 KB) RoHS PB Free

CY7C63823-QXC

Development KitCY3655
애플리케이션Mouse, Wireless Dongle
인증 자동차N
CPU CoreM8C
데이터 전송Interrupt
I/O 옵션USB, PS/2, SPI, GPIO
최대 작동 온도(°C)70
최대 작동 전압(V)5.50
메모리 아키텍처플래시
메모리 크기(KB)8
최소 작동 온도(°C)0
최소 작동 전압(V)4.00
No. of Endpoints3
I/O 수20
소프트웨어 도구C-Compiler (CY366x)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.63 $2.27 $2.15 $1.80 $1.74 $1.62
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
SOP
No. of Pins
24
Package Dimensions
340 L x 1 H x 150 W (Mils)
Package Weight
142.49 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2750
Minimum Order Quantity (MOQ)
1925
Order Increment
1925
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn

기술 문서

애플리케이션 설명 (1)

2020년 5월 28일

제품 변경 고지(PCN) (16)

2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018년 5월 28일
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
2018년 5월 28일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018년 5월 27일
Change in Tube Bundling Ship Process
2018년 5월 27일
Shipping Label Upgrade
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 11월 09일
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
2017년 10월 31일
Q2, 2012 - Q4, 2013 Horizon Report
2017년 10월 30일
Q1, 2012 - Q2, 2013 Horizon Report
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Product Information Notice (PIN) (3)

2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Changes to Cypress Address Labels
2017년 10월 25일
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (3)

2020년 4월 14일
Addendum to PTN173701A - October 2017 Product Obsolescence Notification
2020년 4월 14일
Addendum to PTN173701 - October 2017 Product Obsolescence Notification
2020년 4월 14일
October 2017 Product Obsolescence Notification