CY7C63823-QXC | Cypress Semiconductor
CY7C63823-QXC
| Development Kit | CY3655 |
| 애플리케이션 | Mouse, Wireless Dongle |
| 인증 자동차 | N |
| CPU Core | M8C |
| 데이터 전송 | Interrupt |
| I/O 옵션 | USB, PS/2, SPI, GPIO |
| 최대 작동 온도(°C) | 70 |
| 최대 작동 전압(V) | 5.50 |
| 메모리 아키텍처 | 플래시 |
| 메모리 크기(KB) | 8 |
| 최소 작동 온도(°C) | 0 |
| 최소 작동 전압(V) | 4.00 |
| No. of Endpoints | 3 |
| I/O 수 | 20 |
| 소프트웨어 도구 | C-Compiler (CY366x) |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.63 | $2.27 | $2.15 | $1.80 | $1.74 | $1.62 |
Packaging/Ordering
패키지
No. of Pins
24
Package Dimensions
340 L x 1 H x 150 W (Mils)
Package Weight
142.49 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2750
Minimum Order Quantity (MOQ)
1925
Order Increment
1925
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (1)
제품 변경 고지(PCN) (16)
2020년 5월 8일
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
2018년 5월 28일
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
2018년 5월 28일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 28일
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
2018년 5월 27일
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
2018년 5월 27일
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018년 5월 27일
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2018년 5월 27일
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
2018년 5월 27일
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (3)
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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