CY7C65630-56LTXC | Cypress Semiconductor
CY7C65630-56LTXC
| Development Kit | CY4606 |
| 인증 자동차 | N |
| I/O 옵션 | SPI |
| 최대 작동 온도(°C) | 70 |
| 최대 작동 전압(V) | 3.45 |
| 최소 작동 온도(°C) | 0 |
| 최소 작동 전압(V) | 3.15 |
| No. of Hub Ports | 4 |
| Single/Multi TT | Single |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $15.31 | $13.22 | $12.52 | $10.44 | $10.13 | $9.43 |
Packaging/Ordering
No. of Pins
56
Package Dimensions
315 L x 1 H x 315 W (Mils)
Package Weight
174.18 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(B.4.B)
ECCN Suball
5A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
IPC1752 MATERIAL DECLARATION QFN56 (8X8X1.0 mm) (LT56)_CML_Au WIRE_NiPdAu_HENKEL QMI519_NITTO GE7470
Last Update: 2020년 5월 22일
Package Qualification Report
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
Last Update: 2019년 2월 17일
Last Update: 2015년 12월 22일
기술 문서
애플리케이션 설명 (2)
제품 변경 고지(PCN) (7)
2020년 4월 23일
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2020년 4월 14일
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
2018년 5월 29일
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2017년 10월 23일
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (5)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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