CY8C20236A-24LKXI | Cypress Semiconductor
CY8C20236A-24LKXI
| Development Kit | CY3280-20X66 |
| 인증 자동차 | N |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 5.50 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 1.71 |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $1.89 | $1.81 | $1.73 | $1.65 | $1.57 | $1.44 |
Packaging/Ordering
패키지
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Ni/Pd/Au/Ag
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2015년 8월 31일
기술 문서
기술 참조 설명서(1)
애플리케이션 설명 (18)
2020년 6월 26일
개발 키트/보드 (2)
제품 변경 고지(PCN) (6)
2017년 10월 24일
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
2017년 10월 23일
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (6)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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