CY8C20434-12LQXI | Cypress Semiconductor
CY8C20434-12LQXI
| Development Kit | CY3280-BK1 |
| 인증 자동차 | N |
| CPU Core | M8C |
| CapSense | Y |
| 통신 인터페이스 | I2C, SPI |
| 전용 ADC (No._ 최대 해상도 @ 샘플링 속도) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 없음 |
| 플래시(KB) | 8 |
| LCD Direct Drive | N |
| 최대 작동 주파수(MHz) | 12 |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 5.25 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.40 |
| No. of CapSense Channels | 1 |
| CapSense IO 수 | 25 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| GPIO 개수 | 28 |
| 프로그래밍 가능한 디지털 블록 개수 | 0 |
| PWM | SW |
| 근접 센싱 | N |
| SRAM(KB) | 0.5 |
| SmartSense 작동 | N |
| Tape & Reel | N |
| USB (Type) | 없음 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.09 | $2.00 | $1.91 | $1.83 | $1.74 | $1.59 |
Packaging/Ordering
패키지
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.24 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
기술 문서
기술 참조 설명서(1)
애플리케이션 설명 (18)
2020년 6월 26일
개발 키트/보드 (1)
소프트웨어와 드라이버 (2)
제품 변경 고지(PCN) (10)
2020년 4월 23일
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
2018년 5월 28일
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
2018년 5월 28일
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
2018년 5월 28일
Qualification of Carsem Malaysia as an Additional Assembly Site for 32-lead QFN (5X5X0.6 mm) Package Products Using the Saw Singulation Process
2017년 10월 23일
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (5)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 07일
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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