CY8C21223-24SXIT | Cypress Semiconductor
CY8C21223-24SXIT
| Development Kit | CY3215-DK, CY3213-16SOIC |
| 인증 자동차 | N |
| CPU Core | M8C |
| CapSense | N |
| 전용 ADC (No._ 최대 해상도 @ 샘플링 속도) | 없음 |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 없음 |
| 플래시(KB) | 4 |
| LCD Direct Drive | N |
| 최대 작동 주파수(MHz) | 24 |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 5.25 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 2.40 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 1 |
| GPIO 개수 | 12 |
| 프로그래밍 가능한 아날로그 블록 개수 | 4 |
| 프로그래밍 가능한 디지털 블록 개수 | 4 |
| SRAM(KB) | 0.25 |
| Tape & Reel | Y |
| USB (Type) | 없음 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.42 | $2.09 | $2.02 | $1.83 | $1.65 | $1.32 |
Packaging/Ordering
패키지
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (33)
2020년 6월 26일
2020년 6월 26일
개발 키트/보드 (7)
소프트웨어와 드라이버 (2)
제품 변경 고지(PCN) (14)
2020년 5월 10일
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2020년 5월 6일
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
2018년 5월 28일
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
2018년 5월 28일
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21x23 Device Family
2018년 5월 28일
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21x23 Device Family
2018년 5월 28일
Qualification of Grace Semiconductor as an alternate wafer fabrication site for PSoC CY8C21x23 product family on SONOS4 technology
2018년 5월 27일
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
2018년 5월 27일
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
2017년 10월 24일
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (1)
2018년 5월 27일
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor
Product Information Notice (PIN) (6)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
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