CY8C21334W-12PVXET | Cypress Semiconductor

CY8C21334W-12PVXET
Status: 생산 중

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(pdf, 2.11 MB) RoHS PB Free
(pdf, 1.49 MB) RoHS PB Free

CY8C21334W-12PVXET

Development KitCY3213A-DK, CY3212-20SSOP
인증 자동차Y
CPU CoreM8C
CapSenseY
통신 인터페이스I2C, SPI, UART
전용 ADC (No._ 최대 해상도 @ 샘플링 속도)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)없음
플래시(KB)8
LCD Direct DriveN
최대 작동 주파수(MHz)12
최대 작동 온도(°C)125
최대 작동 전압(V)5.25
최소 작동 온도(°C)-40
최소 작동 전압(V)3.00
No. of CapSense Channels1
CapSense IO 수12
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
GPIO 개수16
프로그래밍 가능한 아날로그 블록 개수1
프로그래밍 가능한 디지털 블록 개수3
PWMHW
근접 센싱Y
SRAM(KB)0.5
슬라이더2
SmartSense 작동N
Tape & ReelY
USB (Type)없음

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.58 $3.43 $3.28 $3.13 $2.98 $2.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
SOP
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
없음
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Ni/Pd/Au

기술 문서

애플리케이션 설명 (32)

2020년 6월 26일
2020년 6월 26일

제품 변경 고지(PCN) (4)

2020년 5월 6일
Qualification of HHGrace Fab 3 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
2020년 5월 6일
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020년 4월 14일
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
2020년 4월 14일
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1

Product Information Notice (PIN) (3)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines