CY8C4125AZI-M445 | Cypress Semiconductor

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CY8C4125AZI-M445
Status: 생산 중

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CY8C4125AZI-M445

인증 자동차N
CPU CoreARM Cortex-M0
CapSenseY
Dedicated ADC (#Max Resolution @ Sample Rate)SAR (1, 12비트 @ 806 ksps)
EEPROM (KB)0
플래시(KB)32
JTAG and Si ID0x1102
LCD Direct DriveY
최대 작동 주파수(MHz)24
최대 작동 온도(°C)85
최대 작동 전압(V)5.50
최소 작동 온도(°C)-40
최소 작동 전압(V)1.71
No. of CAN Controllers0
No. of Continuous Time Blocks1
No. of DMA Channels8
No. of Dedicated Comparators2
No. of Dedicated Timer/Counter/PWM Blocks8
GPIO 개수51
No. of Op Amps2
No. of SIO0
No. of Serial Communication Blocks4
No. of USB IO0
No. of Universal Analog Blocks0
No. of Universal Digital Blocks0
PLLN
SRAM(KB)4
SeriesPSoC 4100M
SeriesPSoC 4100M
Tape & ReelN
USB (Type)없음

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.60 $2.49 $2.38 $2.28 $2.17 $1.98
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 340 24-48 hours

Packaging/Ordering

패키지
FP
No. of Pins
64
Package Dimensions
393 L x 1.4 H x 393 W (Mils)
Package Weight
338.95 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1600
Minimum Order Quantity (MOQ)
320
Order Increment
320
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

기술 문서

애플리케이션 설명 (17)

제품 변경 고지(PCN) (1)

2020년 4월 14일
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for the PSoC® 4200M Product Family

Advanced Product Change Notice (APCN) (4)

2020년 5월 8일
Qualification status of cypress 130nm sonos products at fab 25
2020년 4월 14일
Q419 Horizon Report Update
2020년 4월 14일
Q319 Horizon Report Update
2020년 4월 14일
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization