CY8C4126AXI-M443T | Cypress Semiconductor

CY8C4126AXI-M443T
Status: 생산 중

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CY8C4126AXI-M443T

인증 자동차N
CPU CoreARM Cortex-M0
CapSenseY
Dedicated ADC (#Max Resolution @ Sample Rate)SAR (1, 12비트 @ 806 ksps)
EEPROM (KB)0
플래시(KB)64
LCD Direct DriveY
최대 작동 주파수(MHz)24
최대 작동 온도(°C)85
최대 작동 전압(V)5.50
최소 작동 온도(°C)-40
최소 작동 전압(V)1.71
No. of CAN Controllers0
No. of Continuous Time Blocks1
No. of DMA Channels0
No. of Dedicated Comparators2
No. of Dedicated Timer/Counter/PWM Blocks8
GPIO 개수36
No. of Op Amps2
No. of SIO0
No. of Serial Communication Blocks4
No. of Smart I/Os0
No. of USB IO0
No. of Universal Analog Blocks0
No. of Universal Digital Blocks0
PLLN
SRAM(KB)8
SeriesPSoC 4100M
SeriesPSoC 4100M
Tape & ReelY
USB (Type)없음

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.92 $2.79 $2.67 $2.55 $2.43 $2.22
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
QFP
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
119
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
무연
N
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

기술 문서

애플리케이션 설명 (11)

제품 변경 고지(PCN) (1)

2020년 4월 14일
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for the PSoC® 4200M Product Family

Advanced Product Change Notice (APCN) (3)

2020년 4월 14일
Q419 Horizon Report Update
2020년 4월 14일
Q319 Horizon Report Update
2020년 4월 14일
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization