CY8C5468AXI-LP106 | Cypress Semiconductor
CY8C5468AXI-LP106
| Development Kit | CY8CKIT-050 |
| 인증 자동차 | N |
| 전용 ADC(#_ 최대 해상도 @ 샘플링 속도) | SAR (1, 12비트 @ 1000 ksps) |
| 최대 작동 온도(°C) | 85 |
| 최대 작동 전압(V) | 5.50 |
| 최소 작동 온도(°C) | -40 |
| 최소 작동 전압(V) | 1.71 |
| Part Family | PSoC 5LP |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $6.38 | $6.11 | $5.84 | $5.58 | $5.31 | $4.86 |
Packaging/Ordering
패키지
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
N
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 자재 고지
기술 문서
애플리케이션 설명 (8)
2020년 7월 01일
제품 변경 고지(PCN) (3)
2020년 5월 6일
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (5)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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