CY8C5866AXI-LP020 | Cypress Semiconductor

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CY8C5866AXI-LP020
Status: 생산 중

데이터시트

(pdf, 7.45 MB) RoHS PB Free
(pdf, 4.58 MB) RoHS PB Free
(pdf, 8.06 MB) RoHS PB Free

CY8C5866AXI-LP020

Development KitCY8CKIT-050
인증 자동차N
전용 ADC(#_ 최대 해상도 @ 샘플링 속도)DelSig (1, 20-bit @ 180 sps), SAR (1, 12-bit @ 1000 ksps)
최대 작동 온도(°C)85
최대 작동 전압(V)5.50
최소 작동 온도(°C)-40
최소 작동 전압(V)1.71
Part FamilyPSoC 5LP
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.56 $13.95 $13.34 $12.73 $12.11 $11.10
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

패키지
QFP
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS 준수
Y
무연
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

기술 문서

애플리케이션 설명 (8)

제품 변경 고지(PCN) (4)

2020년 12월 07일
Qualification of UBOT Tray for 100-Lead TQFP 14x14x1.4mm Products at ASE-KH Finish Site
2020년 5월 6일
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family
2017년 10월 25일
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017년 10월 25일
Qualification of Manufacturing Changes for PSoC 5LP Products

Product Information Notice (PIN) (5)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017년 11월 06일
Changes to Cypress Address Labels
2017년 11월 06일
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Boundary Scan BSDL (4)