CY8C6247BZI-D44T | Cypress Semiconductor

CY8C6247BZI-D44T
Status: 생산 중

데이터시트

(pdf, 1.45 MB) RoHS PB Free
(pdf, 1.8 MB) RoHS PB Free
(pdf, 2.29 MB) RoHS PB Free

CY8C6247BZI-D44T

Development KitCY8CKIT-062-BLE
인증 자동차N
BLE Maximum Data Rate (Mbps)0
BLE Power Output (dBm)0
BLE RX Sensitivity (dBm)0
BLE Supported Frequency band (GHz)0
CapSenseY
Cryptographics Accelerator(AES, 3DES, RSA, SHA-512, SHA-256 and ECC)
전용 ADC(#_ 최대 해상도 @ 샘플링 속도)SAR (1, 12비트 @ 1 msps)
전용 DAC(#_ 최대 해상도 @ 샘플링 속도)(1,12-bit @ 200 ksps)
FS-USBDual Host and Device
플래시(KB)1024
I2S1
LCD Direct DriveY
최대 작동 주파수(MHz)150
최대 작동 온도(°C)85
최대 작동 전압(V)3.60
최소 작동 온도(°C)-40
최소 작동 전압(V)1.70
No. of CAN Controllers0
No. of DMA Channels32
No. of Dedicated Comparators2
No. of Dedicated OpAmps0
No. of Dedicated Timer/Counter/PWM Blocks32
GPIO 개수104
프로그래밍 가능한 범용 디지털 블록 개수0
No. of Serial Communication Blocks (I2C, UART, SPI)9
PDM-PCM2
Quad-SPIY
SRAM(KB)288
Secondary CoreARM Cortex-M0
SeriesPSoC 62
Smart I/O16
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.12 $6.82 $6.52 $6.23 $5.93 $5.43
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
124
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS 준수
Y
무연
Y
Lead/Ball Finish
Sn/Ag/Cu

기술 문서

애플리케이션 설명 (15)

제품 변경 고지(PCN) (1)

2020년 4월 14일
Update of Silicon Version for PSoC® 6 MCU (CY8C63XXXXX) from *C to *D

Advanced Product Change Notice (APCN) (1)

2020년 4월 14일
Q419 Horizon Report Update

Product Information Notice (PIN) (2)

2020년 6월 10일
Manufacturing Label and Packing Configuration Standardization
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization