CY9AF312NABGL-GE1 | Cypress Semiconductor

CY9AF312NABGL-GE1

인증 자동차N
Part FamilyFM3
Part FamilyFM3
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.00 $9.00 $8.20 $7.40 $6.80 $5.40
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Packaging/Ordering

No. of Pins
112
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
198
Order Increment
198
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish

기술 문서

애플리케이션 설명 (17)

제품 변경 고지(PCN) (2)

2020년 5월 28일
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
2020년 3월 29일
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products

Advanced Product Change Notice (APCN) (7)

2020년 8월 23일
Q32020 Horizon Report Update
2020년 4월 22일
Q220 Standard Horizon Report Update
2020년 4월 14일
2020 Annual Horizon Report Update
2020년 4월 14일
Q419 Horizon Report Update
2020년 4월 14일
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
2020년 4월 14일
Q319 Horizon Report Update
2020년 4월 14일
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

2020년 4월 14일
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020년 3월 25일
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)