CY9BF217TBGL-GK7E1 | Cypress Semiconductor

CY9BF217TBGL-GK7E1

인증 자동차N
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.17 $16.52 $15.28 $14.04 $12.80 $10.74
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Packaging/Ordering

No. of Pins
192
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
152
Order Increment
152
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
무연
Y
Lead/Ball Finish

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

기술 문서

애플리케이션 설명 (18)

Advanced Product Change Notice (APCN) (1)

2020년 4월 14일
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

2020년 4월 14일
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020년 3월 25일
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)